Current Issue

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Total number of articles in this issue: 3
Total number of pages in this issue: 26

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Year

2025

Volume

2

Number

4

Status

Archived

Published

2025 December 3

Articles

A Comparative Study of Machine Learning Models for Credit Card Fraud Detection

Currently, credit card fraud detection is a unique problem in the financial sector, with both institutions and consumers facing increasingly significant losses. Despite the growing application of machine learning (ML) techniques in this domain, existing methods often struggle with issues such as high false-positive rates, imbalanced data, and the complexity of evolving fraud patterns. This paper investigates the comparative performance of various machine learning models in credit card fraud detection, focusing on traditional models (such as Support Vector Machine, Decision Tree), ensemble methods (Random Forest, XGBoost,deep learning models (Multilayer Perceptron, Artificial Neural Networks). Three distinct datasets, including both balanced and imbalanced sets, are used to evaluate these models. The results indicate that ensemble models like Random Forest and XGBoost demonstrate superior performance, particularly in terms of accuracy, precision, recall, and F1 score, when compared to other models. However, models such as Support Vector Machine and Artificial Neural Networks exhibit lower recall in imbalanced datasets, suggesting potential limitations in their application to real-world fraud detection scenarios. This study also identifies key challenges, such as the difficulty in adapting to dynamic fraud strategies and the need for real-time monitoring. Future research directions are proposed, including the integration of deep learning architectures and adaptive learning mechanisms to enhance the detection system’s real-time response and accuracy. The findings provide a robust foundation for further development of credit card fraud detection systems and offer practical insights for financial institutions seeking to mitigate fraud-related risks.

DOI10.70393/616a6e73.333530ARKark:/40704/AJNS.v2n4a02

Defect Prediction and Optimization in Semiconductor Manufacturing Using Explainable AutoML

The semiconductor manufacturing industry often faces the severe challenges of data scarcity and imbalance. While the semiconductor industry has conducted extensive research on leveraging machine learning to improve yield, defect prediction remains largely unexplored, especially with small datasets. This research proposes a framework called xAutoML, which automatically selects the optimal model and hyperparameters for defect prediction to enhance the interpretability of the results. Furthermore, it addresses the critical issue of data imbalance, a common problem in defect prediction tasks, by employing techniques such as focus loss and oversampling. We use publicly available datasets to demonstrate how xAutoML effectively adapts to data constraints and deeply analyzes key features influencing defect occurrence. Results show that the proposed method outperforms traditional methods in terms of prediction accuracy and the provision of actionable and interpretable insights. Its application in real-time defect monitoring and process optimization in semiconductor manufacturing helps bridge the gap between advanced machine learning techniques and practical industry applications.

DOI10.70393/616a6e73.333533ARKark:/40704/AJNS.v2n4a01

A Data-Driven Approach for Real-Time Bottleneck Detection and Optimization in Semiconductor Manufacturing Using Active Period Method and Visualization

With the rapid development of the semiconductor industry, identifying and optimizing bottlenecks is crucial for improving production line efficiency. This paper proposes a method combining Activity Cycle Method (APM) and data visualization techniques. APM identifies key bottlenecks in semiconductor manufacturing by analyzing the continuous uptime of machines and the duration of their activity cycles. Data visualization tools are then used to present these key bottlenecks in an intuitive and actionable manner. Applying both methods to a real-world semiconductor manufacturing environment significantly improves production efficiency and machine utilization, making this method practically applicable in semiconductor manufacturing.

DOI10.70393/616a6e73.333534ARKark:/40704/AJNS.v2n4a03

Copyright © 2026 The Author(s). Published by Southern United Academy of Sciences.
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